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AD8392AAREZ-R7 データシート(PDF) 5 Page - Analog Devices

部品番号 AD8392AAREZ-R7
部品情報  Low Power, High Output Current, Quad Op Amp, Dual-Channel ADSL/ADSL2 Line Driver
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メーカー  AD [Analog Devices]
ホームページ  http://www.analog.com
Logo AD - Analog Devices

AD8392AAREZ-R7 データシート(HTML) 5 Page - Analog Devices

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AD8392A
Data Sheet
Rev. A | Page 4 of 12
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Rating
Supply Voltage
±13 V (+26 V)
Power Dissipation
See Figure 3
Storage Temperature Range
−65°C to +150°C
Operating Temperature Range
−40°C to +85°C
Lead Temperature (Soldering 10 sec)
300°C
Junction Temperature
150°C
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, θJA is specified
for the device soldered in the circuit board for surface-mount
packages.
Table 3.
Package Type
θJA
Unit
LFCSP-32 (CP)
27.27
°C/W
TSSOP_EP (RE)
35.33
°C/W
Maximum Power Dissipation
The power dissipated in the package (PD) is the sum of the
quiescent power dissipation and the power dissipated in the
package due to the load drive for all outputs. The quiescent
power is the voltage between the supply pins (VS) times the
quiescent current (IS). Assuming that the load (RL) is midsupply,
the total drive power is VS/2 × IOUT, some of which is dissipated
in the package and some in the load (VOUT × IOUT).
RMS output voltages should be considered. If RL is referenced to
VS− as in single-supply operation, the total power is VS × IOUT.
In single supply with RL to VS−, worst case is VOUT = VS/2.
Airflow increases heat dissipation, effectively reducing θJA. In
addition, more metal directly in contact with the package leads
from metal traces, through holes, ground, and power planes
reduces the θJA.
Figure 3 shows the maximum safe power dissipation in the
package vs. the ambient temperature for the LFCSP-32 and
TSSOP_EP packages on a JEDEC standard 4-layer board.
θJA values are approximations.
0
1
2
3
4
5
6
7
–40 –30 –20 –10
0
10
20
30
40
50
60
70
80
90
TEMPERATURE (°C)
TJ = 150°C
LFCSP-32
TSSOP-28/EP
Figure 3. Maximum Power Dissipation vs. Temperature for a 4-Layer Board
See the Thermal Considerations section for additional thermal
design guidance.
ESD CAUTION


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