MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA

33887

5

PGND

NC

V+

V+

V+

V+

NC

NC

NC

NC

D1

IN2

EN

NC

NC

NC

OUT2

OUT2

OUT2

OUT2

NC

NC

D2

PGND

PGND

PGND

PGND

NC

V+

V+

V+

V+

NC

NC

NC

NC

IN1

FS

AGND

NC

NC

NC

NC

OUT1

OUT1

OUT1

OUT1

NC

NC

FB

PGND

PGND

PGND

54

40

.35

34

33

32

31

30

29

28

39

38

37

36

47

46

45

44

43

42

41

51

50

49

48

53

52

1

15

20

21

22

23

24

25

26

27

16

17

18

19

8

9

10

11

12

13

14

4

5

6

7

2

3

Transparent Top View of Package

SOICW-EP TERMINAL DEFINITIONS

A functional description of each terminal can be found in the System/Application Information section, page 19.

Terminal

Terminal

Name

Formal Name

Definition

1–4, 51–54

PGND

Power Ground

High-current power ground.

5–7, 9, 14, 19–22,

27– 29, 33–36, 41,

46, 48–50

NC

No Connect

No internal connection to this terminal.

8

D2

Disable 2

Active LOW input used to simultaneously tri-state disable both H-Bridge

outputs. When D2 is Logic LOW, both outputs are tri-stated.

10–13

OUT2

H-Bridge Output 2

Output 2 of H-Bridge.

15 –18, 37–40

V+

Positive Power Supply

Positive supply connections.

23

Charge Pump Capacitor

External reservoir capacitor connection for internal charge pump capacitor.

24

D1

Disable 1

Active HIGH input used to simultaneously tri-state disable both H-Bridge

outputs. When D1 is Logic HIGH, both outputs are tri-stated.

25

IN2

Logic Input Control 2

Logic input control of OUT2 (i.e., IN2 logic HIGH = OUT2 HIGH).

26

EN

Enable

Logic input Enable control of device (i.e., EN logic HIGH = full operation,

EN logic LOW = Sleep Mode).

30

AGND

Analog Ground

Low-current analog signal ground.

31

FS

Fault Status for H-Bridge

Open drain active LOW Fault Status output requiring a pullup resistor to

5.0 V.

32

IN1

Logic Input Control 1

Logic input control of OUT1 (i.e., IN1 logic HIGH = OUT1 HIGH).

42–45

OUT1

H-Bridge Output 1

Output 1 of H-Bridge.

47

FB

Feedback for H-Bridge

Current feedback output providing ground referenced 1/375th ratio of

H-Bridge high-side current.

Pad

Thermal

Interface

Exposed Pad Thermal

Interface

Exposed pad thermal interface for sinking heat from the device.

Note Must be DC-coupled to analog ground and power ground via very low

impedance path to prevent injection of spurious signals into IC substrate.

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com