LS-BGA136C-61 datasheet(1/1 Pages) IRONWOOD

部品番号	LS-BGA136C-61

部品情報	Materials and specifications are subject to change without notice

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メーカー	IRONWOOD [Ironwood Electronics.]

ホームページ	http://www.ironwoodelectronics.com

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0.2mm dia.

[0.008"]

2.96mm

[0.116"]

4.55mm

[0.179"]

0.8mm typ.

12.8mm

[0.504"]

8.8mm

[0.346"]

10mm

[0.394"]

0.6mm

[0.024"]

0.6mm

[0.024"]

14mm

[0.551"]

Status: Released

Drawing: J. Glab

Scale: 8:1

Rev: C

Date: 2/15/07

Modified: 01/18/13, Dh

File: LS-BGA136C-61 Dwg.mcd

LS-BGA136C-61 Drawing

Tolerances: diameters ±0.03mm [±0.001”], PCB perimeters ±0.13mm [±0.005”], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position)

±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005”] unless stated otherwise. Materials and specifications are subject to change without notice.

Pins: material- Brass Alloy 360 1/2 hard; finish-

0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.).

Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]

FR4/G10 or equivalent high temp material. non

clad

2

1

2

Top View

Side View

Description: Giga-snaP BGA SMT Land Socket

136 position BGA surface mount land pattern to terminal pins (0.8mm centers, 17x8 array)

11351 Rupp Drive, Suite 400, Burnsville, MN 55337

Tele: (952) 229-8200

www.ironwoodelectronics.com

RoHS

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