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LS-BGA136C-61 データシート(PDF) 1 Page - Ironwood Electronics. |
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LS-BGA136C-61 データシート(HTML) 1 Page - Ironwood Electronics. |
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1 / 1 page 0.2mm dia. [0.008"] 2.96mm [0.116"] 4.55mm [0.179"] 0.8mm typ. 12.8mm [0.504"] 8.8mm [0.346"] 10mm [0.394"] 0.6mm [0.024"] 0.6mm [0.024"] 14mm [0.551"] Status: Released Drawing: J. Glab Scale: 8:1 Rev: C Date: 2/15/07 Modified: 01/18/13, Dh File: LS-BGA136C-61 Dwg.mcd LS-BGA136C-61 Drawing Tolerances: diameters ±0.03mm [±0.001”], PCB perimeters ±0.13mm [±0.005”], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position) ±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005”] unless stated otherwise. Materials and specifications are subject to change without notice. Pins: material- Brass Alloy 360 1/2 hard; finish- 0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.). Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material. non clad 2 1 1 2 Top View Side View Description: Giga-snaP BGA SMT Land Socket 136 position BGA surface mount land pattern to terminal pins (0.8mm centers, 17x8 array) © 2007 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com RoHS RoHS |
同様の部品番号 - LS-BGA136C-61 |
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同様の説明 - LS-BGA136C-61 |
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