データシートサーチシステム |
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SM-BGA-9043 データシート(PDF) 3 Page - Ironwood Electronics. |
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SM-BGA-9043 データシート(HTML) 3 Page - Ironwood Electronics. |
3 / 4 page 5.70±0.08 6.50±0.08 TOP VIEW Pin A1 orientation A B B SEATING PLANE C 0.25 0.40 6.00 5.20 0.25 0.275±0.050 Ironwood package code: BGA178A 0.10 M C A B 0.05 M C 0.555±0.020 0.74±0.03 0.185±0.025 DETAIL B 0.08 0.01 C C Dimensions are in millimeters. 1. Interpret dimensions and tolerances per ASME Y14.5M-1994. 2. Ball diameter is measured at the maximum solder ball diameter, parallel to datum plane C. 3. Datum C (seating plane) is defined by the spherical crowns of the solder balls. 4. Parallelism measurement shall exclude any effect of mark on top surface of package. 5. Compatible BGA IC BOTTOM VIEW FRONT VIEW Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. Description: IC package Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. STATUS: Released REV. B DATE: 12/12/2013 Material: N/A Finish: N/A Weight: 6.53 SM-BGA-9043 Drawing SCALE: 10:1 SHEET: 3 OF 4 ENG: S. Faiz FILE: SM-BGA-9043 Dwg DRAWN BY: M. Raske |
同様の部品番号 - SM-BGA-9043 |
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同様の説明 - SM-BGA-9043 |
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