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SMP-QFN-8016 データシート(PDF) 2 Page - Ironwood Electronics. |
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SMP-QFN-8016 データシート(HTML) 2 Page - Ironwood Electronics. |
2 / 5 page 0.850±0.050 THRU (x2) NON-PLATED HOLE 3.000 2.000 9.725±0.050 (x4) 1.700±0.1 THRU (x4) NON-PLATED HOLE 1.250 2.500 12.225 Socket base outline R0.150 4.8625 1.725 A Orientation mark 0.55x0.3 pad (x24) 0.500 typ. 0.500 typ. 0.55x0.3 pad DETAIL A Scale: 14:1 SM contact locations (do NOT locate vias at SM contact points) Target PCB Recommendations Total thickness: 1.6mm min. Plating: Gold or Solder finish PCB Pad height: same or higher than solder mask. Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. Description: SMP-QFN24 4.75x4.75mm 0.5mm pitch Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. STATUS: Released REV. A DATE: 6/30/2016 Material: N/A Finish: N/A Weight: 6.57 SMP-QFN-8016 Drawing SCALE: 7:1 SHEET: 2 OF 5 ENG: S. Huang FILE: SMP-QFN-8016 Dwg DRAWN BY: M. Raske |
同様の部品番号 - SMP-QFN-8016 |
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同様の説明 - SMP-QFN-8016 |
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