D

E

A1 Ball Corner

A

A1

b

e

Ironwood Package Code: BGA 424A

1. Dimensions are in millimeters.

2. Interpret dimensions and tolerances per ASME Y14.5M-1994.

3. Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z.

4. Datum C (seating plane) is defined by the spherical crowns of the solder balls.

5. Parallelism measurement shall exclude any effect of mark on top surface of package.

DIM

Minimum Maximum

A

1.70

1.90

A1

1.47

1.57

b

0.25

0.35

D

12.00 BSC

E

12.00 BSC

e

0.50 BSC

ARRAY

23 x 23

PIN COUNT

424

Ironwood Electronics, Inc.

Tele: (800) 404-0204

www.ironwoodelectronics.com

Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all

other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.

Description: Compatible BGA

Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.

STATUS: Released

REV. A

DATE: 08/19/2014

Material: N/A

Finish: N/A

Weight: 27.12

SMP-BGA-8005 Drawing

SCALE: 5:1

SHEET: 3 OF 4

ENG: M.A. Fedde

FILE: SMP-BGA-8005 Dwg

DRAWN BY: M. Raske