データシートサーチシステム |
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SMP-BGA-8005 データシート(PDF) 1 Page - Ironwood Electronics. |
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SMP-BGA-8005 データシート(HTML) 1 Page - Ironwood Electronics. |
1 / 4 page 20.225 28.225 A A 2.500 20.650 22.270 28.225 6.000 20.725 20.225 B SECTION A-A DETAIL B SCALE 16 : 1 Interposer PCB Ball Guide DUT Interposer Protective Layer IC Guide SMP-BGA DIRECT MOUNT, SOLDERLESS SOCKET FOR BURN-IN AND TEST APPLICATIONS FEATURES: Wide temperature range (-55C to +155C ) High current capability (up to 4A ) Excellent signal integrity at high frequencies Low and stable contact resistance for reliable production yield Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. Description: SMP-BGA424 12mm IC 23x23 0.5mm pitch Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. STATUS: Released REV. A DATE: 08/19/2014 Material: N/A Finish: N/A Weight: 27.12 SMP-BGA-8005 Drawing SCALE: 2:1 SHEET: 1 OF 4 ENG: M.A. Fedde FILE: SMP-BGA-8005 Dwg DRAWN BY: M. Raske |
同様の部品番号 - SMP-BGA-8005 |
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同様の説明 - SMP-BGA-8005 |
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