38.500

28.225

57.500

24.950

28.225

15.000

17.900

2.670

A

A

double latch lid

W/ compression plate

IC

Removable IC guide

B

SECTION A-A

Recommended torque = 5 in-lbs

/ 56.5 N-cm

DETAIL B

SCALE 8 : 1

xGA IC

IC guide

SMP protective layer

SMP SM interposer layer

target board

SMP-CGA DIRECT MOUNT, SOLDERLESS SOCKET FOR

BURN-IN AND TEST APPLICATIONS

FEATURES:

Wide temperature range (-55C to +155C )

High current capability (up to 4A )

Excellent signal integrity at high frequencies

Low and stable contact resistance for reliable production yield

Ironwood Electronics, Inc.

Tele: (800) 404-0204

www.ironwoodelectronics.com

Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all

other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.

Description: Double latch snap lid SMP xGA255 21x21mm IC 16x16 array 1.27mm pitch

Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.

STATUS: Released

REV. A

DATE: 06/10/2015

Material: N/A

Finish: N/A

Weight: 94.65

SMP-CGA-3001 Drawing

SCALE: 1.15:1

SHEET: 1 OF 9

ENG: S. Huang

FILE: SMP-CGA-3001 Dwg

DRAWN BY: M. Raske