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C2220X154MCRALTU データシート(PDF) 17 Page - Kemet Corporation |
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C2220X154MCRALTU データシート(HTML) 17 Page - Kemet Corporation |
17 / 22 page © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1025_X7R_HV_FT-CAP_SMD • 7/29/2016 17 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Voltage with Flexible Termination System, X7R Dielectric, 500 – 3,000 VDC (Commercial Grade) Figure 1 – Embossed (Plastic) Carrier Tape Dimensions Po T F W Center Lines of Cavity Ao Bo User Direction of Unreeling Cover Tape Ko B 1 is for tape feeder reference only, including draft concentric about B o . T2 ØD 1 ØDo B 1 S 1 T1 E 1 E 2 P 1 P 2 Embossment For cavity size, see Note 1 Table 4 [10 pitches cumulative tolerance on tape ± 0.2 mm] Table 6 – Embossed (Plastic) Carrier Tape Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) Tape Size D 0 D 1 Minimum Note 1 E 1 P 0 P 2 R Reference Note 2 S 1 Minimum Note 3 T Maximum T 1 Maximum 8 mm 1.5 +0.10/-0.0 (0.059 +0.004/- 0.0) 1.0 (0.039) 1.75 ±0.10 (0.069 ±0.004) 4.0 ±0.10 (0.157 ±0.004) 2.0 ±0.05 (0.079 ±0.002) 25.0 (0.984) 0.600 (0.024) 0.600 (0.024) 0.100 (0.004) 12 mm 1.5 (0.059) 30 (1.181) 16 mm Variable Dimensions — Millimeters (Inches) Tape Size Pitch B 1 Maximum Note 4 E 2 Minimum F P 1 T 2 Maximum W Maximum A 0,B0 & K0 8 mm Single (4 mm) 4.35 (0.171) 6.25 (0.246) 3.5 ±0.05 (0.138 ±0.002) 4.0 ±0.10 (0.157 ±0.004) 2.5 (0.098) 8.3 (0.327) Note 5 12 mm Single (4 mm) & Double (8 mm) 8.2 (0.323) 10.25 (0.404) 5.5 ±0.05 (0.217 ±0.002) 8.0 ±0.10 (0.315 ±0.004) 4.6 (0.181) 12.3 (0.484) 16 mm Triple (12 mm) 12.1 (0.476) 14.25 (0.561) 7.5 ±0.05 (0.138 ±0.002) 12.0 ±0.10 (0.157 ±0.004) 4.6 (0.181) 16.3 (0.642) 1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and hole location shall be applied independent of each other. 2. The tape with or without components shall pass around R without damage (see Figure 6). 3. If S 1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481 paragraph 4.3 section b). 4. B 1 dimension is a reference dimension for tape feeder clearance only. 5. The cavity defined by A 0, B0 and K0 shall surround the component with sufficient clearance that: (a) the component does not protrude above the top surface of the carrier tape. (b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. (c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3). (d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see Figure 4). (e) for KPS Series product, A 0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket. (f) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements. |
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