Avago Technologies

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HLMP-HG70/71, HLMP-HL70/71

Data Sheet

Avago Technologies LED Configuration

Avago Technologies LED Configuration

NOTE

Electrical connection between the bottom

surface of the LED die and the lead frame is

achieved through conductive paste.



Any alignment fixture that is being applied during wave

soldering should be loosely fitted and should not apply

weight or force on the LED. Non- metal material is

recommended because it will absorb less heat during the

wave soldering process.

NOTE

To further assist the customer in designing he

jig accurately that fits the Avago

Technologies’ product, a 3D model of the

product is available upon request.



At elevated temperatures, the LED is more susceptible to

mechanical stress. Therefore, the PCB must allowed to cool

down to room temperature prior to handling, which

includes removal of the alignment fixture or pallet.



If the PCB board contains both through hole (TH) LEDs and

other surface mount components, it is recommended that

surface mount components be soldered on the top side of

the PCB. If surface mount must be on the bottom side,

these components should be soldered using reflow

soldering prior to insertion of the TH LED.



The recommended PC board plated through holes (PTH)

size for LED component leads follows.



Over-sizing the PTH can lead to a twisted LED after

clinching. On the other hand, under-sizing the PTH can

cause difficulty when inserting the TH LED.

Application Precautions

1.

The drive current of the LED must not exceed the

maximum allowable limit across temperature as stated in

the data sheet. Constant current driving is recommended

to ensure consistent performance.

2.

LEDs exhibit slightly different characteristics at different

drive currents that might result in larger performance

variation (i.e., intensity, wavelength, and forward voltage).

The user is recommended to set the application current as

close as possible to the test current to minimize these

variations.

3.

The LED is not intended for reverse bias. Use other

appropriate components for such purposes. When driving

the LED in matrix form, it is crucial to ensure that the

reverse bias voltage does not exceed the allowable limit of

the LED.

Anode

LED component lead

size

Diagonal

Plated through hole

diameter

0.45 mm × 0.45 mm

(0.018 in. × 0.018 in.)

0.636 mm

(0.025 in.)

0.98 mm to 1.08 mm

(0.039 in. to 0.043 in.)

0.50 mm × 0.50 mm

(0.020 in. × 0.020 in.)

0.707 mm

(0.028 in.)

1.05 mm to 1.15 mm

(0.041 in. to 0.045 in.)