DocID025629 Rev 3

5/10

BAL-CC1101-01D3

Package information

2

Package information



Epoxy meets UL94, V0



Lead-free package

In order to meet environmental requirements, ST offers these devices in different grades of

specifications, grade definitions and product status are available at: www.st.com.

2.1

Flip-Chip package information

Figure 10. Flip-Chip package outline

Table 3. Flip-Chip package mechanical data

Parameter

Description

Min.

Typ.

Max.

Unit

A

Bump height + substrate thickness

0.570

0.630

0.690

mm

b

Bump diameter

0.215

0.255

0.295

mm

D

Y dimension of the die

1.970

2.020

2.070

mm

D1

Y pitch

1.200

mm

E

X dimension of the die

1.000

1.050

1.100

mm

E1

X pitch

0.500

mm

fE

Distance from bump to edge of die on X axis

0.225

mm