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TPA2016D2RTJT データシート(PDF) 5 Page - Texas Instruments

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部品番号 TPA2016D2RTJT
部品情報  2.8-W/Ch Stereo Class-D Audio Amplifier With Dynamic Range Compression and Automatic Gain Control
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メーカー  TI1 [Texas Instruments]
ホームページ  http://www.ti.com
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TPA2016D2RTJT データシート(HTML) 5 Page - Texas Instruments

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TPA2016D2
www.ti.com
SLOS524E – JUNE 2008 – REVISED MAY 2016
Product Folder Links: TPA2016D2
Submit Documentation Feedback
Copyright © 2008–2016, Texas Instruments Incorporated
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted).
(1)
MIN
MAX
UNIT
VDD
Supply voltage
AVDD, PVDDR, PVDDL
–0.3
6
V
Input voltage
SDZ, INR+, INR–, INL+, INL–
–0.3
VDD + 0.3
V
SDA, SCL
–0.3
6
Continuous total power dissipation
See Dissipation Ratings
TA
Operating free-air temperature
–40
85
°C
TJ
Operating junction temperature
–40
150
°C
RLOAD
Minimum load resistance
3.2
Tstg
Storage temperature
–65
150
°C
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic
discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2000
V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)
±500
7.3 Recommended Operating Conditions
MIN
MAX
UNIT
VDD
Supply voltage
AVDD, PVDDR, PVDDL
2.5
5.5
V
VIH
High-level input voltage
SDZ, SDA, SCL
1.3
V
VIL
Low-level input voltage
SDZ, SDA, SCL
0.6
V
TA
Operating free-air temperature
–40
+85
°C
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
7.4 Thermal Information
THERMAL METRIC(1)
TPA2016D2
UNIT
YZH (DSBGA)
RTJ (QFN)
16 PINS
20 PINS
RθJA
Junction-to-ambient thermal resistance
71
33.3
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
0.4
22.5
°C/W
RθJB
Junction-to-board thermal resistance
14.4
9.6
°C/W
ψJT
Junction-to-top characterization parameter
1.9
0.2
°C/W
ψJB
Junction-to-board characterization parameter
13.6
9.6
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
2.4
°C/W


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