TLV809 datasheet(4/22 Pages) TI1

部品番号	TLV809

部品情報	3-Pin Voltage Supervisors with Active-Low, Open-Drain Reset

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TLV803, TLV853, TLV863

SBVS157C – APRIL 2011 – REVISED SEPTEMBER 2015

www.ti.com

7 Specifications

7.1 Absolute Maximum Ratings

(1)

over operating junction temperature range (unless otherwise noted)

MIN

MAX

UNIT

VDD(2)

0

7

Voltage

V

All other pins(2)

–0.3

+7

Maximum low output current, IOL

5

Maximum high output current, IOH

–5

Current

mA

Input clamp current, IIK (VI < 0 or VI > VDD)

±20

Output clamp current, IOK (VO < 0 or VO > VDD)

±20

Operating junction temperature range, TJ

–40

125

Temperature

°C

Storage temperature range, Tstg

–65

150

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values are with respect to GND. For reliable operation the device should not be operated at 7 V for more than t = 1000h

continuously

7.2 ESD Ratings

VALUE

UNIT

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

Electrostatic

V(ESD)

V

discharge

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Thermal Information

TLV8x3

THERMAL METRIC(1)

DBZ (SOT-23)

UNITS

3 PINS

RθJA

Junction-to-ambient thermal resistance

328.5

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

135.4

°C/W

RθJB

Junction-to-board thermal resistance

58.3

°C/W

ψJT

Junction-to-top characterization parameter

5.2

°C/W

ψJB

Junction-to-board characterization parameter

59.6

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

7.4 Recommended Operating Conditions

at specified temperature range (unless otherwise noted)

MIN

MAX

UNIT

VDD

Supply voltage

1.1

6

V

TJ

Operating junction temperature

–40

125

°C

4

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