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LM2715 データシート(PDF) 7 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
部品番号 LM2715
部品情報  TFT Panel Module
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メーカー  NSC [National Semiconductor (TI)]
ホームページ  http://www.national.com
Logo NSC - National Semiconductor (TI)

LM2715 データシート(HTML) 7 Page - National Semiconductor (TI)

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Electrical Characteristics (Continued)
Specifications in standard type face are for T
J = 25˚C and those with boldface type apply over the full Operating Tempera-
ture Range (T
J = −40˚C to +125˚C). Unless otherwise specified VIN =2.2V, AVIN = 8V, RCOM =RGAMMA =50
Ω,C
COM =
C
GAMMA = 1nF.
Gamma Buffer
Symbol
Parameter
Conditions
Min
(Note 4)
Typ
(Note 5)
Max
(Note 4)
Units
Is+
Supply Current (Amplifier +
Buffer)
Vo=AV
IN/2, No Load
2.5
4.3
mA
I
SC
Output Short Circuit Current
Source
50
66
75
mA
Sink
40
56
65
Electrical Characteristics
Specifications in standard type face are for T
J = 25˚C and those with boldface type apply over the full Operating Tempera-
ture Range (T
J = −40˚C to +125˚C). Unless otherwise specified VIN =2.2V, AVIN = 8V, RCOM =RGAMMA =50
Ω,C
COM =
C
GAMMA = 1nF.
PMOS Switch Logic Control
Symbol
Parameter
Conditions
Min
(Note 4)
Typ
(Note 5)
Max
(Note 4)
Units
I
DELAY
Delay Current
5.1
5.7
6.1
µA
R
DSON
PMOS Switch ON Resistance
7
20
I
SWO
PMOS Switch Current
Switch ON
20
mA
I
SWI
PMOS Switch Input Current
SWC = 0V, SWO Open, SWI
= 30V
50
100
µA
SWC = 1.7V, SWO Open,
SWI = 30V
175
350
V
SWC
Switch ON
1.5
1.1
V
Switch OFF
1.1
0.7
Note 1: The maximum allowable power dissipation is a function of the maximum junction temperature, TJ(MAX), the junction-to-ambient thermal resistance, θJA,
and the ambient temperature, TA. The maximum allowable power dissipation at any ambient temperature is calculated using: PD (MAX) = (TJ(MAX) −TA)/θJA.
Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown.
Note 2: Absolute maximum ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions for which the device is intended to
be functional, but device parameter specifications may not be guaranteed. For guaranteed specifications and test conditions, see the Electrical Characteristics.
Note 3: The human body model is a 100 pF capacitor discharged through a 1.5k
Ω resistor into each pin. The machine model is a 200pF capacitor discharged
directly into each pin.
Note 4: All limits guaranteed at room temperature (standard typeface) and at temperature extremes (bold typeface). All room temperature limits are 100%
production tested or guaranteed through statistical analysis. All limits at temperature extremes are guaranteed via correlation using standard Statistical Quality
Control (SQC) methods. All limits are used to calculate Average Outgoing Quality Level (AOQL).
Note 5: Typical numbers are at 25˚C and represent the most likely norm.
Note 6: Duty cycle affects current limit due to ramp generator. See Typical Performance Characteristics for a graph of Power Switch Current Limit vs. VIN and Power
Switch Current Limit vs. Temp.
Note 7: See Typical Performance Characteristics section for Tri-Temperature data for RDSON vs. VIN.
Note 8: Bias current flows into pin.
Note 9: Refer to the graphs titled "Input Offset Voltage vs. Common Mode Voltage".
www.national.com
7


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