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74LVC1G58 データシート(PDF) 2 Page - NXP Semiconductors

部品番号 74LVC1G58
部品情報  Low-power configurable multiple function gate
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メーカー  PHILIPS [NXP Semiconductors]
ホームページ  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

74LVC1G58 データシート(HTML) 2 Page - NXP Semiconductors

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© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet
Rev. 01 — 15 September 2004
2 of 18
Philips Semiconductors
74LVC1G58
Low-power configurable multiple function gate
3.
Quick reference data
[1]
CPD is used to determine the dynamic power dissipation (PD in µW).
PD =CPD × VCC2 × fi × N+ Σ(CL × VCC2 × fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
CL = output load capacitance in pF;
VCC = supply voltage in Volts;
N = total load switching outputs;
Σ(C
L × VCC
2
× f
o) = sum of the outputs.
[2]
The condition is VI = GND to VCC.
4.
Ordering information
5.
Marking
Table 1:
Quick reference data
GND = 0 V; Tamb =25 °C; tr =tf ≤ 2.5 ns.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
tPHL, tPLH propagation delay
input A, B and
C to output Y
VCC = 1.8 V; CL =30pF;
RL =1kΩ
-6
-ns
VCC = 2.5 V; CL =30pF;
RL = 500 Ω
-
3.5
-
ns
VCC = 2.7 V; CL =50pF;
RL = 500 Ω
-
4.2
-
ns
VCC = 3.3 V; CL =50pF;
RL = 500 Ω
-
3.8
-
ns
VCC = 5.0 V; CL =50pF;
RL = 500 Ω
-
3.0
-
ns
CI
input capacitance
-
2.5
-
pF
CPD
power dissipation
capacitance per buffer
VCC = 3.3 V
[1] [2] -20
-
pF
Table 2:
Ordering information
Type number
Package
Temperature range
Name
Description
Version
74LVC1G58GW
−40 °C to +125 °C
SC-88
plastic surface mounted package; 6 leads
SOT363
74LVC1G58GV
−40 °C to +125 °C
SC-74
plastic surface mounted package; 6 leads
SOT457
74LVC1G58GM
−40 °C to +125 °C
XSON6
plastic extremely thin small outline package; no
leads; 6 terminals; body 1
× 1.45 × 0.5 mm
SOT886
Table 3:
Marking
Type number
Marking code
74LVC1G58GW
YK
74LVC1G58GV
V58
74LVC1G58GM
YK


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