5

SN74AUP1G80

www.ti.com

SCES593F – JULY 2004 – REVISED JULY 2017

Product Folder Links: SN74AUP1G80

Submit Documentation Feedback

Copyright © 2004–2017, Texas Instruments Incorporated

Recommended Operating Conditions (continued)

See

(1)

MIN

MAX

UNIT

20

µA

1.1

mA

1.7

1.9

3.1

4

Δt/Δv

Input transition rise or fall rate

200

ns/V

Operating free-air temperature

–40

85

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

SN74AUP1G80

UNIT

DBV (SOT)

DCK (SC70)

DRY (SON)

DSF (SON)

YFP (DSBGA)

YZP (DSBGA)

DPW (X2SON)

5 PINS

5 PINS

6 PINS

6 PINS

6 PINS

5 PINS

5 PINS

Junction-to-ambient

thermal resistance

267.2

284.1

341.1

377.1

125.4

146.2

489.2

°C/W

Junction-to-case (top)

thermal resistance

191.9

208.5

233.1

187.7

1.9

1.4

226.3

°C/W

Junction-to-board

thermal resistance

101.1

103.1

206.7

236.6

37.2

39.3

352.9

°C/W

Junction-to-top

characterization

parameter

83.0

76.6

63.4

29.0

0.5

0.7

38.2

°C/W

Junction-to-board

characterization

parameter

100.8

102.3

206.7

236.3

37.5

39.8

352.1

°C/W

Junction-to-case

(bottom) thermal

resistance

n/a

n/a

n/a

n/a

n/a

n/a

150.8

°C/W