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GS8673ED18BGK-500I データシート(PDF) 7 Page - GSI Technology

部品番号 GS8673ED18BGK-500I
部品情報  72Mb SigmaQuad-IIIe??Burst of 4 ECCRAM?
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メーカー  GSI [GSI Technology]
ホームページ  http://www.gsitechnology.com
Logo GSI - GSI Technology

GS8673ED18BGK-500I データシート(HTML) 7 Page - GSI Technology

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GS8673ED18/36BK-675/625/550/500
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Rev: 1.06 5/2012
7/31
© 2011, GSI Technology
Reset (RST) Requirements
Although not generally recommended, RST may be asserted High at any time after completion of the initial power-up sequence
described previously, to reset the SRAM control logic to its initial power-on state. However, whenever RST is subsequently
de-asserted Low (as in Step 4 in the power up sequence), Steps 5~7 in the power-up sequence must be followed before Read and
Write operations are initiated.
Note: Memory array content may be perturbed/corrupted when RST is asserted High.
DLL Operation
An on-chip DLL is used to align output timing with input clocks. The DLL uses the CK input clock as a source, and is enabled
when all of the following conditions are met:
1. The DLL pin is asserted High, and
2. The RST pin is de-asserted Low, and
3. The input clock tKHKH ≤ 6.0ns.
Once enabled, the DLL requires 64K (65,536) stable clock cycles in order to synchronize properly.
The DLL can tolerate changes in input clock frequency due to clock jitter (i.e. such jitter will not cause the DLL to lose lock/
synchronization), provided the cycle-to-cycle jitter does not exceed 200ps (see the tKJITcc specification in the AC Electrical
Characteristics section for more information). However, the DLL must be resynchronized (i.e. disabled and then re-enabled)
whenever the nominal input clock frequency is changed.
When the DLL is enabled, read latency is determined by the RLM mode pins, as defined in the Read Latency section. Output
timing is aligned with the input clocks.
The DLL is disabled when any of the following conditions are met:
1. The DLL pin is de-asserted Low, or
2. The RST pin is asserted High, or
3. The input clock is stopped for at least 30ns, or tKHKH ≥ 30ns.
On-Chip Error Correction
SigmaQuad-IIIe ECCRAMs implement a single-bit error detection and correction algorithm (specifically, a Hamming Code) on
each DDR data word (comprising two 9-bit data bytes) transmitted on each 9-bit data bus (i.e., transmitted on D/Q[8:0], D/Q[17:9],
D/Q[26:18], or D/Q[35:27]). To accomplish this, 5 ECC parity bits (invisible to the user) are utilized per every 18 data bits (visible
to the user).
The ECC algorithm neither corrects nor detects multi-bit errors. However, GSI ECCRAMs are architected in such a way that a
single SER event very rarely causes a multi-bit error across any given “transmitted data unit”, where a “transmitted data unit”
represents the data transmitted as the result of a single read or write operation to a particular address. The extreme rarity of
multi-bit errors results in the SER mentioned previously (i.e., <0.002 FITs/Mb (measured at sea level)).
Not only does the on-chip ECC significantly improve SER performance, but it also frees up the entire memory array for data
storage. Very often SRAM applications allocate 1/9th of the memory array (i.e., one “error bit” per eight “data bits”, in any 9-bit
“data byte”) for error detection (either simple parity error detection, or system-level ECC error detection and correction). Such
error-bit allocation is unnecessary with ECCRAMs the entire memory array can be utilized for data storage, effectively providing
12.5% greater storage capacity compared to SRAMs of the same density not equipped with on-chip ECC.


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