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GS81302T09E-250 データシート(PDF) 7 Page - GSI Technology

部品番号 GS81302T09E-250
部品情報  144Mb SigmaDDRTM-II Burst of 2 SRAM
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メーカー  GSI [GSI Technology]
ホームページ  http://www.gsitechnology.com
Logo GSI - GSI Technology

GS81302T09E-250 データシート(HTML) 7 Page - GSI Technology

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GS81302T08/09/18/36E-375/350/333/300/250
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Rev: 1.03b 12/2011
7/35
© 2011, GSI Technology
Background
Common I/O SRAMs, from a system architecture point of view, are attractive in read dominated or block transfer applications.
Therefore, the SigmaDDR-II SRAM interface and truth table are optimized for burst reads and writes. Common I/O SRAMs are
unpopular in applications where alternating reads and writes are needed because bus turnaround delays can cut high speed
Common I/O SRAM data bandwidth in half.
Burst Operations
Read and write operations are "burst" operations. In every case where a read or write command is accepted by the SRAM, it will
respond by issuing or accepting two beats of data, executing a data transfer on subsequent rising edges of K and K, as illustrated in
the timing diagrams. This means that it is possible to load new addresses every K clock cycle. Addresses can be loaded less often,
if intervening deselect cycles are inserted.
Deselect Cycles
Chip Deselect commands are pipelined to the same degree as read commands. This means that if a deselect command is applied to
the SRAM on the next cycle after a read command captured by the SRAM, the device will complete the two beat read data transfer
and then execute the deselect command, returning the output drivers to high-Z. A high on the LD pin prevents the RAM from
loading read or write command inputs and puts the RAM into deselect mode as soon as it completes all outstanding burst transfer
operations.
SigmaDDR-II Burst of 2 SRAM Read Cycles
The SRAM executes pipelined reads. The status of the Address, LD and R/W pins are evaluated on the rising edge of K. The read
command (LD low and R/W high) is clocked into the SRAM by a rising edge of K. After the next rising edge of K, the SRAM
produces data out in response to the next rising edge of C (or the next rising edge of K, if C and C are tied high). The second beat
of data is transferred on the next rising edge of C, for a total of two transfers per address load.
SigmaDDR-II Burst of 2 SRAM Write Cycles
The status of the Address, LD and R/W pins are evaluated on the rising edge of K. The SRAM executes "late write" data transfers.
Data in is due at the device inputs on the rising edge of K following the rising edge of K clock used to clock in the write command
(LD and R/W low) and the write address. To complete the remaining beat of the burst of two write transfer, the SRAM captures
data in on the next rising edge of K, for a total of two transfers per address load.


同様の部品番号 - GS81302T09E-250

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同様の説明 - GS81302T09E-250

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