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TLV743285PDBVR データシート(PDF) 4 Page - Texas Instruments

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部品番号 TLV743285PDBVR
部品情報  300-mA, Low-Dropout Regulator
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メーカー  TI1 [Texas Instruments]
ホームページ  http://www.ti.com
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TLV743P
SBVS310 – JULY 2017
www.ti.com
Product Folder Links: TLV743P
Submit Documentation Feedback
Copyright © 2017, Texas Instruments Incorporated
6 Specifications
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.1 Absolute Maximum Ratings
over operating junction temperature range (unless otherwise noted); all voltages are with respect to GND
(1)
MIN
MAX
UNIT
Voltage
VIN
–0.3
6
V
VEN
–0.3
VIN + 0.3
VOUT
–0.3
3.6
Current
IOUT
Internally limited
A
Output short-circuit duration
Indefinite
Temperature
Operating junction, TJ
–40
150
°C
Storage, Tstg
–65
160
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2000
V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)
±500
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
VIN
Input range
1.4
5.5
V
VOUT
Output range
1
3.3
V
IOUT
Output current
0
300
mA
VEN
Enable range
0
VIN
V
TJ
Junction temperature
–40
125
°C
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6.4 Thermal Information
THERMAL METRIC(1)
TLV743P
UNIT
DBV (SOT-23)
5 PINS
RθJA
Junction-to-ambient thermal resistance
228.4
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
151.5
°C/W
RθJB
Junction-to-board thermal resistance
55.8
°C/W
ψJT
Junction-to-top characterization parameter
31.4
°C/W
ψJB
Junction-to-board characterization parameter
54.8
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
N/A
°C/W


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