TSL1401R

128 × 1 LINEAR SENSOR ARRAY WITH HOLD

TAOS035B – AUGUST 2002

8

t

t

Copyright

E 2002, TAOS Inc.

The

LUMENOLOGY

r Company

www.taosinc.com

MECHANICAL INFORMATION

This dual-in-line package consists of an integrated circuit mounted on a lead frame and encapsulated in an electrically

nonconductive clear plastic compound.

8

°

90

°

100

°

Seating Plane

5

8

4

1

10

°

6

7

23

8

°

8

°

C

L

0.440 (11,18)

0.420 (10,67)

0.260 (6,60)

0.240 (6,61)

j 0.30 (0,76) NOM

0.10 (2,54)

0.060 (1,52)

0.040 (1,02)

0.130 (3,30)

0.120 (3,05)

0.025 (0,64)

0.015 (0,38)

0.150 (3,81)

0.125 (3,18)

0.053 (1,35)

0.043 (1,09)

0.175 (9,78)

0.155 (7,75)

0.310 (7,87)

0.290 (7,37)

0.260 (6,60)

0.240 (6,10)

0.012 (0,30)

0.008 (0,20)

0.075 (1,91)

0.060 (1,52)

0.016 (0,41)

0.014 (0,36)

Die Thickness

C

L Pixels

C

L Package

0.017 (0,43)

C

L Pin 1

Centerline of Pin 1 Nominally

Lies Between Pixels 5 and 6.

NOTES: A. All linear dimensions are in inches and (millimeters).

B. Index of refraction of clear plastic is 1.55.

C. This drawing is subject to change without notice.

Figure 9. Packaging Configuration