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SML-H12D8T データシート(PDF) 8 Page - Rohm |
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SML-H12D8T データシート(HTML) 8 Page - Rohm |
8 / 11 page [Data Sheet] Stress strength according to he mounting position: A>B>C>D so please pay attention to the touch on product. We recommend the soldering pattern that shows on the right. It will be different according to mounting situation of circuit board, therefore, please concern before designing. ※The product has adopted the electrode structure that it should solder with back electrode of the product. Thus, please be informed that the shape of electrode pin of solder fillet formation is not guaranteed. The through hole on electrode surface is for conduction of front and rear electrodes but not for formation of solder fillet. In case of carrying out flow soldering of surrounding parts without recommended conditions, please contact us for inquiries. to avoid bending or screwing with great stress of the circuit board. 4―4. Mechanical Stress after Mounting The mechanical stress may damage the LED after Circuit Mounting, 4-5.Soldering Pattern for Recommendation ・Please set appropriate reflow temperature based on our product usage conditions and specification. to prevent electrostatic charge. 4-3. Mounting Location The stress like bending stress of circuit board dividing after mounting, may cause LED package crack ・The max for reflowing is 2 times, please finish the second reflow soldering and flow soldering with other parts within the usage limitation after open the moistureproof package. 4-1. Soldering [SML-H12x(C) series] ・No resin hardening agent such as filler is used in the sealing resin of the product. Therefore, resin expansion and moisture absorption at humidity will cause heat stress during soldering process and 4.Mounting shift (within 3℃/sec. of temperature gradient) during the flow soldering of surrounding parts. ・The product is not guaranteed for flow soldering. ・Do not expose the product in the environment of high temperature (over 100℃) or rapid temperature or damage of LED internal junction, therefore, please concern the mounting direction and position ・Compare with N2 reflow, during air reflow, because of the heat and surrounding conditions, it may cause the discoloration of the resin. ・For our product that has no solder resist, because of its solder amount and soldering conditions, the mounter to control the product stabilization. In addition, it is recommended to set ionizer one of its specific characteristics is that solder will penetrate into LED. Thus, there's high possibility that will influence its reliability.Therefore, please be informed, concerning it before using it. 4-2. Automatic Mounting 4-2-1. Silicon Resin Sealing Product The sealing resin of LED is very soft, so please select adsorption nozzle that would not apply stress directly on the sealing section. 4-2-2. Mini Package (Smaller than 1608 size) ・Vibration may result in low mounting rate since it will cause the static electricity of product and adhere to top cover tape. Therefore, the magnet should be set on parts feeder cassette of finally has bad influence on the product’s reliability. 1.1mm 1.1mm 1.25mm 1.25mm PCB Bonding Direction ________________________________________________________ www.rohm.com ©2016 ROHM Co., Ltd. All rights reserved 8/9 2017.5 - Rev.005 |
同様の部品番号 - SML-H12D8T |
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同様の説明 - SML-H12D8T |
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