[Data Sheet]

Stress strength according to

he mounting position:

A＞B＞C＞D

so please pay attention to the touch on product.

We recommend the soldering pattern that shows on the right.

It will be different according to mounting situation of circuit board,

therefore, please concern before designing.

※The product has adopted the electrode structure that it should solder

with back electrode of the product.

Thus, please be informed that the shape of electrode pin of

solder fillet formation is not guaranteed.

The through hole on electrode surface is for conduction of front

　and rear electrodes but not for formation of solder fillet.

４―４. Mechanical Stress after Mounting

The mechanical stress may damage the LED after Circuit Mounting,

４－５．Soldering Pattern for Recommendation

to prevent electrostatic charge.

４－３. Mounting Location

The stress like bending stress of circuit board dividing after mounting, may cause LED package crack

or damage of LED internal junction, therefore, please concern the mounting direction and position

　one of its specific characteristics is that solder will penetrate into LED. Thus, there's high possibility

４-２-１. Silicon Resin Sealing Product

The sealing resin of LED is very soft, so please select adsorption nozzle that would not apply stress

４-２-２. Mini Package (Smaller than 1608 size)

・Vibration may result in low mounting rate since it will cause the static electricity of product and

with other parts within the usage limitation after open the moistureproof package.

・Compare with N2 reflow, during air reflow, because of the heat and surrounding conditions,

it may cause the discoloration of the resin.

・For our product that has no solder resist, because of its solder amount and soldering conditions,

４－２. Automatic Mounting

・The product is not guaranteed for flow soldering.

In case of carrying out flow soldering of surrounding parts without recommended conditions, please

contact us for inquiries.

・Please set appropriate reflow temperature based on our product usage conditions and specification.

・The max for reflowing is 2 times, please finish the second reflow soldering and flow soldering

[SML-P12x/P13x series]

４．Mounting

４－１. Soldering

・No resin hardening agent such as filler is used in the sealing resin of the product. Therefore, resin

expansion and moisture absorption at humidity will cause heat stress during soldering process and

・Do not expose the product in the environment of high temperature (over 100℃) or rapid temperature

shift (within 3℃/sec. of temperature gradient) during the flow soldering of surrounding parts.

finally has bad influence on the product’s reliability.

that will influence its reliability.Therefore, please be informed, concerning it before using it.

directly on the sealing section.

adhere to top cover tape. Therefore, the magnet should be set on parts feeder cassette of

the mounter to control the product stabilization. In addition, it is recommended to set ionizer

to avoid bending or screwing with great stress of the circuit board.

0.6mm

0.4mm

0.5mm

0.5mm

PCB Bonding Direction

Mask open area ratio

：80%

Mask thickness

：80〜100μm

Reference

＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿

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