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AD9251 データシート(PDF) 11 Page - Analog Devices

部品番号 AD9251
部品情報  1.8 V Dual Analog-to-Digital Converter
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メーカー  AD [Analog Devices]
ホームページ  http://www.analog.com
Logo AD - Analog Devices

AD9251 データシート(HTML) 11 Page - Analog Devices

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AD9251
Data Sheet
Rev. A | Page 10 of 36
ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter
Rating
AVDD to AGND
−0.3 V to +2.0 V
DRVDD to AGND
−0.3 V to +3.9 V
VIN+A, VIN+B, VIN−A, VIN−B to AGND
−0.3 V to AVDD + 0.2 V
CLK+, CLK− to AGND
−0.3 V to AVDD + 0.2 V
SYNC to AGND
−0.3 V to DRVDD + 0.3 V
VREF to AGND
−0.3 V to AVDD + 0.2 V
SENSE to AGND
−0.3 V to AVDD + 0.2 V
VCM to AGND
−0.3 V to AVDD + 0.2 V
RBIAS to AGND
−0.3 V to AVDD + 0.2 V
CSB to AGND
−0.3 V to DRVDD + 0.3 V
SCLK/DFS to AGND
−0.3 V to DRVDD + 0.3 V
SDIO/DCS to AGND
−0.3 V to DRVDD + 0.3 V
OEB to AGND
−0.3 V to DRVDD + 0.3 V
PDWN to AGND
−0.3 V to DRVDD + 0.3 V
D0A/D0B through D13A/D13B to AGND
−0.3 V to DRVDD + 0.3 V
DCOA/DCOB to AGND
−0.3 V to DRVDD + 0.3 V
Operating Temperature Range (Ambient)
−40°C to +85°C
Maximum Junction Temperature
Under Bias
150°C
Storage Temperature Range (Ambient)
−65°C to +150°C
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL CHARACTERISTICS
The exposed paddle is the only ground connection for the chip.
The exposed paddle must be soldered to the AGND plane of the
user’s circuit board. Soldering the exposed paddle to the user’s
board also increases the reliability of the solder joints and
maximizes the thermal capability of the package.
Typical θJA is specified for a 4-layer PCB with a solid ground
plane. As shown in Table 7, airflow improves heat dissipation,
which reduces θJA. In addition, metal in direct contact with the
package leads from metal traces, through holes, ground, and
power planes, reduces the θJA.
Table 7. Thermal Resistance
PackageType
Airflow
Velocity
(m/sec)
θJA1,2
θJC1,3
θJB1,4
Unit
64-Lead LFCSP
0
23
2.0
°C/W
(CP-64-4)
1.0
20
12
°C/W
2.5
18
°C/W
1
Per JEDEC 51-7, plus JEDEC 25-5 2S2P test board.
2
Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).
3
Per MIL-Std 883, Method 1012.1.
4
Per JEDEC JESD51-8 (still air).
ESD CAUTION


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