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LMK60A0-148M35SIAT データシート(PDF) 10 Page - Texas Instruments |
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LMK60A0-148M35SIAT データシート(HTML) 10 Page - Texas Instruments |
10 / 18 page 10 LMK60E2-150M, LMK60E0-156257 LMK60A0-148351, LMK60A0-148M SNAS687C – JUNE 2016 – REVISED NOVEMBER 2017 www.ti.com Product Folder Links: LMK60E2-150M LMK60E0-156257 LMK60A0-148351 LMK60A0-148M Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated 8 Power Supply Recommendations For best electrical performance of LMK60XX, TI recommends using a combination of 10 µF, 1 µF and 0.1 µF on its power supply bypass network. TI also recommends using component side mounting of the power supply bypass capacitors, and it is best to use 0201 or 0402 body size capacitors to facilitate signal routing. Keep the connections between the bypass capacitors and the power supply on the device as short as possible. Ground the other side of the capacitor using a low impedance connection to the ground plane. Figure 12 shows the layout recommendation for power supply decoupling of LMK60XX. 9 Layout 9.1 Layout Guidelines The following sections provides recommendations for board layout, solder reflow profile and power supply bypassing when using LMK60XX to ensure good thermal / electrical performance and overall signal integrity of entire system. 9.1.1 Ensuring Thermal Reliability The LMK60XX is a high performance device. Therefore pay careful attention to device configuration and printed- circuit board (PCB) layout with respect to power consumption. The ground pin needs to be connected to the ground plane of the PCB through three vias or more, as shown in Figure 12, to maximize thermal dissipation out of the package. Equation 1 describes the relationship between the PCB temperature around the LMK60XX and its junction temperature. TB = TJ – ΨJB * P where • TB: PCB temperature around the LMK60XX • TJ: Junction temperature of LMK60XX • ΨJB: Junction-to-board thermal resistance parameter of LMK60XX (37.7°C/W without airflow) • P: On-chip power dissipation of LMK60XX (1) To ensure that the maximum junction temperature of LMK60XX is below 120°C, it can be calculated that the maximum PCB temperature without airflow should be at 90°C or below when the device is optimized for best performance resulting in maximum on-chip power dissipation of 0.68 W. 9.1.2 Best Practices for Signal Integrity For best electrical performance and signal integrity of entire system with LMK60XX, TI recommends routing vias into decoupling capacitors and then into the LMK60XX. TI also recommends increasing the via count and width of the traces wherever possible. These steps ensure lowest impedance and shortest path for high-frequency current flow. Figure 12 shows the layout recommendation for LMK60XX. |
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同様の説明 - LMK60A0-148M35SIAT |
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