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LMK60I2-100M00SIAR データシート(PDF) 9 Page - Texas Instruments |
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LMK60I2-100M00SIAR データシート(HTML) 9 Page - Texas Instruments |
9 / 19 page 9 LMK60E2-125M, LMK60E2-156M, LMK60E0-156M LMK60E0-212M, LMK60I2-100M, LMK60I2-322M www.ti.com SNAS718B – DECEMBER 2016 – REVISED OCTOBER 2017 Product Folder Links: LMK60E2-125M LMK60E2-156M LMK60E0-156M LMK60E0-212M LMK60I2-100M LMK60I2- 322M Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated 8 Power Supply Recommendations For best electrical performance of LMK60EX, TI recommends using a combination of 10 µF, 1 µF, and 0.1 µF on its power-supply bypass network. TI also recommends using component side mounting of the power-supply bypass capacitors and it is best to use 0201 or 0402 body size capacitors to facilitate signal routing. Keep the connections between the bypass capacitors and the power supply on the device as short as possible. Ground the other side of the capacitor using a low impedance connection to the ground plane. Figure 9 shows the layout recommendation for power supply decoupling of LMK60EX. 9 Layout 9.1 Layout Guidelines The following sections provides recommendations for board layout, solder reflow profile, and power supply bypassing when using LMK60EX to ensure good thermal and electrical performance, along with overall signal integrity of entire system. 9.1.1 Ensuring Thermal Reliability The LMK60EX is a high-performance device. Therefore, pay careful attention to device configuration and the printed-circuit board (PCB) layout with respect to power consumption. The ground pin must be connected to the ground plane of the PCB through three vias or more, as shown in Figure 9, to maximize thermal dissipation out of the package. Equation 1 describes the relationship between the PCB temperature around the LMK60EX and its junction temperature. TB = TJ – ΨJB * P where • TB: PCB temperature around the LMK60EX • TJ: Junction temperature of LMK60EX • ΨJB: Junction-to-board thermal resistance parameter of LMK60EX (48.7°C/W without airflow) • P: On-chip power dissipation of LMK60EX (1) To ensure that the maximum junction temperature of LMK60EX is below 105°C, it can be calculated that the maximum PCB temperature without airflow should be at 87°C or below when the device is optimized for best performance resulting in maximum on-chip power dissipation of 0.36 W. 9.1.2 Best Practices for Signal Integrity For best electrical performance and signal integrity of entire system with LMK60EX, TI recommends routing vias into decoupling capacitors and then into the LMK60EX. TI also recommends increasing the via count and width of the traces wherever possible. These steps ensure lowest impedance and shortest path for high frequency current flow. Figure 9 shows the layout recommendation for LMK60EX. |
同様の部品番号 - LMK60I2-100M00SIAR |
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同様の説明 - LMK60I2-100M00SIAR |
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