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TMP461 データシート(PDF) 2 Page - Texas Instruments

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部品番号 TMP461
部品情報  Radiation Hardened Remote and Local Digital Temperature Sensor
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メーカー  TI1 [Texas Instruments]
ホームページ  http://www.ti.com
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TMP461 データシート(HTML) 2 Page - Texas Instruments

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TMP461-SP
SBOS902 – SEPTEMBER 2017
www.ti.com
Product Folder Links: TMP461-SP
Submit Documentation Feedback
Copyright © 2017, Texas Instruments Incorporated
4 Device and Documentation Support
4.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
4.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
4.3 Trademarks
E2E is a trademark of Texas Instruments.
SMBus is a trademark of Intel Corporation.
All other trademarks are the property of their respective owners.
4.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
4.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
5 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.


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