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ADE9000 データシート(Datasheet) 10 Page - Analog Devices

部品番号. ADE9000
部品情報  High Performance, Multiphase Energy Power Quality Monitoring IC
ダウンロード  73 Pages
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メーカー  AD [Analog Devices]
ホームページ  http://www.analog.com
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Data Sheet
ADE9000
Rev. A | Page 9 of 72
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 3.
Parameter
Rating
VDD to GND
−0.3 V to +3.96 V
Analog Input Voltage to GND, IAP, IAN, IBP,
IBN, ICP, ICN, VAP, VAN, VBP, VBN, VCP, VCN
−2 V to +2 V
Reference Input Voltage to REFGND
−0.3 V to +2 V
Digital Input Voltage to GND
−0.3 V to VDD + 0.3 V
Digital Output Voltage to GND
−0.3 V to VDD + 0.3 V
Operating Temperature
Industrial Range
−40°C to +85°C
Storage Temperature Range
−65°C to +150°C
Junction Temperature
125°C
Lead Temperature (Soldering, 10 sec)1
260°C
ESD
Human Body Model2
4 kV
Machine Model3
300 V
Field Induced Charged Device Model
(FICDM) 4
1.25 kV
1
Analog Devices recommends that reflow profiles used in soldering RoHS
compliant devices conform to J-STD-020D.1 from JEDEC. Refer to JEDEC for
the latest revision of this standard.
2
Applicable standard: ANSI/ESDA/JEDEC JS-001-2014.
3
Applicable standard: JESD22-A115-A (ESD machine model standard of
JEDEC).
4
Applicable standard: JESD22-C101F (ESD FICDM standard of JEDEC).
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Careful attention to
PCB thermal design is required.
θJA and θJC are specified for the worst case conditions, that is, a
device soldered in a circuit board for surface-mount packages.
Table 4. Thermal Resistance
Package Type
θJA
θJC
Unit
CP-40-71
27.14
3.13
°C/W
1
The junction to air measurement uses a 2S2P JEDEC test board with 4 × 4
standard JEDEC vias. The junction to case measurement uses a 1S0P JEDEC test
board with 4 × 4 standard JEDEC vias. See JEDEC standard JESD51-2.
ESD CAUTION




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