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AD6677BCPZ データシート(PDF) 10 Page - Analog Devices

部品番号 AD6677BCPZ
部品情報  80 MHz Bandwidth, IF Receiver
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メーカー  AD [Analog Devices]
ホームページ  http://www.analog.com
Logo AD - Analog Devices

AD6677BCPZ データシート(HTML) 10 Page - Analog Devices

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AD6677
Data Sheet
Rev. C | Page 10 of 48
ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter
Rating
Electrical
AVDD to AGND
−0.3 V to +2.0 V
DRVDD to DRGND
−0.3 V to +2.0 V
DVDD to DGND
−0.3 V to +2.0 V
VIN+, VIN− to AGND
−0.3 V to AVDD + 0.2 V
CLK+, CLK− to AGND
−0.3 V to AVDD + 0.2 V
RFCLK to AGND
−0.3 V to AVDD + 0.2 V
VCM to AGND
−0.3 V to AVDD + 0.2 V
CS, PDWN to DGND
−0.3 V to DVDD + 0.3 V
SCLK to DGND
−0.3 V to DVDD + 0.3 V
SDIO to DGND
−0.3 V to DVDD + 0.3 V
RST to DGND
−0.3 V to DVDD + 0.3 V
FD to DGND
−0.3 V to DVDD + 0.3 V
SERDOUT0+, SERDOUT0− to AGND
−0.3 V to DRVDD + 0.3 V
SYNCINB+, SYNCINB− to DGND
−0.3 V to DVDD + 0.3 V
SYSREF+, SYSREF− to AGND
−0.3 V to AVDD + 0.3 V
Environmental
Operating Temperature Range
(Ambient)
−40°C to +85°C
Maximum Junction Temperature
Under Bias
150°C
Storage Temperature Range
(Ambient)
−65°C to +125°C
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL CHARACTERISTICS
The exposed pad must be soldered to the ground plane of the
LFCSP package. This increases the reliability of the solder
joints, maximizing the thermal capability of the package.
Table 7. Thermal Resistance
PackageType
Airflow
Velocity
(m/sec)
θJA1,2
θJC1,3,4
θJB1,4,5
Unit
32-Lead LFCSP
5 mm × 5 mm
(CP-32-12)
0
37.1
3.1
20.7
°C/W
1.0
32.4
N/A
N/A
°C/W
2.5
29.1
N/A
N/A
°C/W
1
Per JEDEC 51-7, plus JEDEC 25-5 2S2P test board.
2
Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).
3
Per MIL-STD-883, Method 1012.1.
4
N/A means not applicable.
5
Per JEDEC JESD51-8 (still air).
Typical θJA is specified for a 4-layer printed circuit board (PCB)
with a solid ground plane. As shown in Table 7, airflow increases
heat dissipation, which reduces θJA. In addition, metal in direct
contact with the package leads from metal traces, through holes,
ground, and power planes reduces the θJA.
ESD CAUTION


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